December, 10, 2016, 06:00 3dfxzone.it  ][  amdzone.it  ][  atizone.it  ][  enboard  ][  forumzone.it  ][  hwsetup.it  ][  nvidiazone.it  ][  unixzone.it 
 

 

   
Mobile
RSS
Tags
Sitemap
Contact us
About us
         your source for 3dfx and games
 
Home   ][   News   ][   Games   ][   Articles   ][   3dfx Hardware   ][   3dfx Software   ][   Video   ][   Components   ][   Tools   ][   Forums
 








 
Main

News
Headlines
Games
Articles
3dfx Hardware
3dfx Software
Video Cards
Components
Tools
File Browser
Communities
Contact Us

Voodoo Cards
3dfx Headlines
3dfx Articles
Voodoo1
Voodoo2
Banshee
Voodoo3
Voodoo4/5
VoodooTV
Latest Drivers
Our Releases
Hot Files
 
Games Settings
 
Best Settings
 
TnL Patches
 
MesaFX
 
WickedGL
 
Glide 3x
 
Official FAQ
 
Just For Fun
 
Main menu
Components

Processors
Motherboards
RAM Memories
Video Cards
Audio Cards
HDDs/SSDs
Optical Burners
Web Connectivity
Drivers Index
Main menu

Video Cards

AMD/ATI
Matrox
NVIDIA
S3 Graphics
XGI
Main menu

Tools
Antivirus
Benchmarks
Data Recovery
Mastering
Screensavers
Video
File Sharing
Tweakers
3D-Analyze
Windows Tools
Uninstallers
Mobile Phones
Tools Index
Main menu
Games
Bonus Packs
Demos
DirectX
Latest MAME
Patches
Screenshots
System Requirements
Trailers
Main menu
Communities
 
 06.12.2005   AMD & IBM working to a new 65 nanometer process technology
 

WASHINGTON, D.C. -- December 6, 2005 --In papers presented at the International Electron Devices Meeting (IEDM) in Washington, D.C., IBM (NYSE: IBM) and AMD (NYSE: AMD) today detailed their progress in bringing new, advanced semiconductor process technologies and materials to the 65 nanometer (nm) technology generation.

The companies announced that they have successfully combined embedded Silicon Germanium (e-SiGe) with Dual Stress Liner (DSL) and Stress Memorization technology (SMT) on Silicon-On-Insulator (SOI) wafers, resulting in a 40 percent increase in transistor performance compared to similar chips produced without stress technology, while controlling power consumption and heat dissipation. The new process technologies reduce interconnect delay through the use of lower dielectric constant (lower-K) insulators, which can improve overall product performance and lower power consumption. In addition, the new technologies have shown ability to be manufactured at the 65nm generation and scaleable for use in future generations.

“Our joint work on developing advanced process technologies continues to ensure we can create and provide the highest performance, lowest power processors on the market,” said Nick Kepler, vice president of logic technology development at AMD. “Yet again, we can add another achievement to our list of successes that demonstrate how shared expertise and skills can result in overcoming roadblocks and creating more valuable innovations for customers.”

“At IBM, we strongly believe that our unique joint development partnership with AMD at East Fishkill, N.Y. is key to overcoming power and heat challenges as the industry reaches near atomic scales,” said Gary Patton, vice president, technology development at IBM's Semiconductor Research and Development Center. “The successful integration of leadership technologies from IBM, AMD and our partners at 65nm demonstrates the strength of our collaborative innovation model.”

Additional details about third generation strain technology innovations from AMD and IBM will be disclosed at the 2005 IEEE International Electron Devices Meeting, December 5-7, 2005 in Washington, D.C. This technology was developed as part of the AMD and IBM joint development alliance at AMD’s fabrication facilities in Dresden, Germany, and at the IBM Semiconductor Research and Development Center in East Fishkill, N.Y. in Taiwan.



Source: AMD Press Release
Links


Tags: amd  |  ibm  |  processo  |  tecnologia

 PREVIOUS MORE NEWS GO BACK NEXT 


[ Go Back ]

Latest News
Prime foto della motherboard gaming-oriented Aorus Z270X-Gaming 7 di GIGABYTE

Benchmark Utilities: PassMark PerformanceTest 9.0 build 1006

GPU Information Utilities: GPU-Z 1.13.0 - AMD Radeon Pro Duo Ready

Qualcomm annuncia Centriq 2400, i primi processori per server prodotti a 10nm

Intel lancerà i processori high-end Skylake-X e Kaby Lake-X nel Q317

Slitta leggermente la data di rilascio del game Space Hulk: Deathwing

Capcom pubblica tre gameplay trailer del Resident Evil 7: Biohazard

Microsoft dimostra che un SoC ARM può eseguire Windows 10 e le app Win32

CudaText 1.5.4.0 è un editor di sviluppo open source con plug-in in Python

Un driver per MacOS svela due nuove GPU AMD: Polaris 12 e Polaris 10 XT2
more News 
Latest Utilities Latest Drivers
Passmark PerformanceTest 9.0 bui...

GPU-Z 1.13.0

CudaText 1.5.4.0

USB Oblivion 1.11.2.0

FastCopy 3.26
more Utilities 
AMD Radeon Software Crimson Edit...

Samsung NVM Express Driver 2.0

AMD Radeon Software Crimson Edit...

AMD Radeon Software Crimson Edit...

AMD Radeon Software Crimson Edit...
more Drivers 
Latest Trailers Latest Screenshots
Resident Evil 7 - GamePlay video...

Resident Evil 7 - GamePlay video...

Resident Evil 7 - GamePlay video...

The Last of Us Part II - PlaySta...

Mass Effect: Andromeda - Officia...
more Trailers 
Space Hulk: Deathwing #2

Space Hulk: Deathwing

Conan Exiles

Final Fantasy XV #6

Forza Horizon 3
more Screenshots 
Latest Demos Latest Patches
Forza Horizon 3 Demo

[Official] METAL GEAR SURVIVE: T...

Unity Adam Demo - Full Version

Unity GDC Demo - Adam - Part I

PlayStation VR - PSX 2015 Tech D...
more Demos 
DOOM Update #2

Rise of the Tomb Raider PC Patch...

Rise of the Tomb Raider PC Patch...

Rise of the Tomb Raider PC Patch...

Star Wars Battlefront - Update D...
more Patches 

Advertising
Help

Search 3dfxzone.it
Search with TAGs
Search the Web
Sitemap
Translator

Other Services

Feed RSS



Print This
Our History

Contact Us

User Support
Advertising
Partnership
Banner Exchange
Webmaster
Main menu

Our Network
3dfxzone.it
AMDZone.it
ATIZone.it
HWSetup.it
ForumZone.it
NVIDIAZone.it
UnixZone.it
Hosted Sites
KoolSmoky Home
Rosario Gallery
 
Hardware Setup    |    Site Map    |    Translator    |    News Archive    |    Links    |    Contact Us    |    Legal Notes    |    Privacy
 

On line since Q1 2001    |    Web Application and Contents © 3dfxzone.it    |    All Rights Reserved